Identification of Tire Abrasion Microparticles Using SEM-EDX

In order to answer the question of the whereabouts of microplastic particles from tire abrasion, new analysis methods are urgently needed to reliably identify and count these particles. We conducted a pilot study to test the possibilities of automated SEM-EDX analysis in quantifying tire abrasion in environmental samples.

High Aspect Ratio Tomography for Samples with a High Aspect Ratio

For the latest generation of SkyScan micro-CT devices, Bruker has developed a special scan mode for samples with a high aspect ratio. Objects of this type are characterized by a high ratio of length to width and repeatedly pose challenges for users of microtomography.

MicroQuick Particle Scanner in Operation at University of Heilbronn

Since the beginning of this year, Heilbronn University has had a MicroQuick particle scanner from RJL Micro & Analytic GmbH. Mrs. Prof. Dr. Katja Mannschreck from the Process and Environmental Engineering course and her students have already successfully used the particle scanner in a number of projects.

Tracking down the Killer Particle

When it comes to component cleanliness, the hardest particles cause the most damage. The difficulty, however, is finding these killer particles because they can be so small that they cannot be seen with a light microscope.

Successful Confirmation of our ISO-17025 Accreditation

Yesterday we had a working visit from the German Accreditation Body (DAkkS), who audited our management system for ISO-17025 accreditation. Monitoring of this type is carried out by the DAkkS at regular intervals, and our processes are put through their paces.

MicroQuick Recognized in ISO-16232 and VDA 19.1

The revised quality standard ISO-16232 “Road vehicles-Cleanliness of components of fluid circuits” was published in December 2018. This international standard for the cleanliness analysis of automotive parts corresponds to the regulations of VDA 19.1, in the development of which RJL Micro & Analytic GmbH played a key role.